Equipment Based on Advanced Technology
Laser Cutter for LCD Substrates
Keywords: liquid crystal plate, thin film photovoltaic cell, laser beam machining, laser scribing
 Appearance
of laser cutter |
IIC supplies a laser beam machine for cutting or repairing the arrayed pattern of LCD substrates. IIC can meet your requirements for working speed, accuracy and laser-formed patterns as well as for pattern repair. This system can be used for laser scribing of thin-film photovoltaic cells, such as the amorphous type and micro-crystal thin-film photovoltaic cells, among other applications |
Features
- Three corner alignment marks are identified by pattern recognition and the cutting position is corrected by an algorithm to ensure precision cutting performance.
- An interlock mechanism keeps operators safe by preventing laser light from leaking outside when the cover is removed.
- The system is designed to comply with the class 1 laser safety code.
- Production-proven laser cutter for class 100 clean room conditions and capable of class 10 use.
- The system features a pumping system for removing cut conductive particles.
Specifications
| Applicable substrate size | Proven in G4 production and applicable to G6 substrates |
| Cutting repeatability | Less than 50 μm in both the X and Y directions |
| Maximum cutting speed | 200 mm/sec |
| Laser wavelength | 1061 nm |
| Equipped with communication interface with loader/unloader system | |
| Equipment dimensions | 2000 x 3500 x 3000 mm (H x W x D) for G6 substrates |
| Weight | 6500 kg for G6 substrates |
| Power source | AC 200 V, three phase, less than 70 A, 50/60 Hz |
Options
- Cleanning unit & ionizer
- Transfer robot
IIC can customize the laser cutter specifications to meet your requirements, including a large glass plate size.
 Cutting
of a short ring |
 TCO
thin layer |
Supply list
Major LCD manufacturers in Japan
LCD manufacturers in Taiwan
